JY Electronics introduces unidirectional four-channel, ultra-low capacitance, ultra-low clamping voltage, small package protection devices TT0354SP / TT0354SP-HFx – suitable for electrostatic protection solutions for high-speed interfaces such as USB3.X.

The Continuous Increase and Popularization of USB Application Demands

With the growing consumer demand for faster data transfer speeds and stability, the proliferation of new USB standards like USB 3.0, USB 3.1, and USB 3.2 provides users with quicker data transfer rates and more reliable connections. Many devices, such as smartphones, tablets, laptops, e-readers, digital cameras, Internet of Things (IoT) modules, and external storage devices, have adopted the USB interface as the standard for data transfer and charging.

The increasing consumer demand for USB applications leads to a higher demand for electrostatic protection. The potential hazards of static electricity to electronic products include:

• Electronic device damage: Electrostatic discharge/surge can cause instantaneous high voltage, exceeding the tolerance of USB controller chips or circuits, leading to damage to the USB interface or circuit board, rendering the device inoperative.

• Data loss or corruption: Electrostatic discharge/surge can also interfere with USB signal transmission, leading to data transfer errors or loss, affecting the functionality and performance of the device.

Therefore, to protect the safety of USB interfaces on electronic products, the use of electrostatic surge suppressors (ESD, Electro-Static discharge) or transient voltage suppressors (TVS) and other protective devices becomes crucial.

JY’s Protective Solution

TT0354SP / TT0354SP-HFx

JY Electronics has launched new ESD products TT0354SP/TT0354SP-HFx to protect USB 3.X from electrostatic discharge/surge damage (for signal line protection), with the following advantages:

• To ensure the integrity of high-speed signals transmitted through USB 3.X, the new products both have ultra-low capacitance (at VR=0V, f = 1MHz: TT0354SP has a typical value of 0.45 pF, and TT0354SP-HFx has a typical value of 0.43 pF).

• Using our company’s unique deep snapback leading-edge patent technology, the new products both have lower clamping voltages (at IPP=5.5A, TT0354SP has a clamping voltage of 3.6 V, and TT0354SP-HFx has a clamping voltage of 3.3 V). Compared to ordinary non-snapback and shallow snapback devices, the deep snapback feature of the new products provides better protection for the circuit.

• They have high ESD endurance, capable of withstanding 12kV contact discharge and 15kV air discharge ESD shocks as tested by IEC 61000-4-2.

• The compact design features a four-channel integrated array DFN2510 package, which minimizes the space occupied on the PCB and is more cost-effective.

JY’s Selected USB 3.X Electrostatic Protection Solution

ESD Performance Parameter Table for Signal and Power Protection

TT0354SP Datasheet

TT0354SP-HFx Datasheet

Layout Design Considerations:

• Place ESD protection devices as close as possible to I/O connectors to reduce ESD grounding paths and enhance protection performance.

• PCB routing should preferably have rounded corners or 45-degree angles, avoiding right-angle wiring to prevent unnecessary reflections.

• Maintain equal trace lengths between the positive and negative lines of differential data channels to avoid the generation of common mode noise and impedance mismatch.